MUP-C7013-27
MUP-C7013-27 ₹28.16 (Inc. GST)
₹23.86 (+18% GST Extra)
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MUP-C7050-02
MUP-C7050-02 ₹28.16 (Inc. GST)
₹23.86 (+18% GST Extra)

MUP-C7020-02

SKU: 26086 Categories: , Brand:
  • A low-profile (1.80mm), 6-pin plus detection switch, Push-Push type Mini SIM card socket designed for surface mount (SMT) applications in smart terminals and handheld devices.

₹28.16 (Inc. GST)

₹23.86 (+18% GST Extra)

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In stock

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  • All products will be shipped within 3-7 days.
  • Free delivery on orders above Rs 499
  • Warranty Info

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Description

Manufactured by MUP Industrial, the C7020-02 is a high-performance SIM card holder that utilizes a “push-to-insert, push-to-eject” spring mechanism, significantly reducing the risk of card jams or improper removal. It includes an integrated Normally Open (NO) detection switch, allowing the host system to instantly recognize when a card is present. The body is constructed from high-temperature thermoplastic (UL 94V-0) to survive IR reflow soldering, and the stainless steel shell provides structural rigidity. Its flat, compact footprint is specifically optimized for automated pick-and-place assembly.

Features:

  • Push-Push Action: Spring-loaded mechanism for easy “click-in/click-out” card handling.
  • Integrated Switch: Features a card detection pin to verify card presence.
  • Low Profile: Only 1.80mm height, ideal for thin portable electronics.
  • Secure Contact: Phosphor bronze contacts with gold plating for anti-oxidation and high signal integrity.
  • Mis-insertion Protection: Mechanical internal geometry prevents the card from being locked in the wrong orientation.

Package Includes:

  • 1 x MUP-C7020-02 Push-Push SIM Card Connector.

Specification

Card Type : Mini SIM (Standard 2FF Size)
Number of Pins : 6 Signal Pins + 2 Switch Pins
Mechanism : Push-Push (Auto-Eject)
Dimensions : 27.60mm (L) x 18.70mm (W) x 1.80mm (H)
Switch Type : Normally Open (NO)
Durability : 3,000 to 5,000 Cycles Minimum
Operating Temperature : -40¡C to +85¡C
Contact Resistance : 50m½ typical / 100m½ Max
Insulation Resistance : >1000M½ at 500V DC
Solderability (IR Reflow) : 250¡C for 5 Seconds Max

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