MUP-C7091-04

The MUP-C7091-04 is a surface-mount (SMD) connector engineered for Micro SIM cards (3FF). It features a robust “push-to-lock, push-to-eject” mechanism that ensures smooth card handling and secure latching even in high-vibration environments. Built with a high-temperature thermoplastic housing, it is fully compatible with lead-free IR reflow soldering. The connector is equipped with gold-plated phosphor bronze contacts to provide superior conductivity and resistance to oxidation, making it ideal for high-stakes industrial and consumer applications where long-term functionality is essential.

Features:

• Push-Push Mechanism: Spring-loaded design for easy, tool-free card insertion and ejection.
• Compact Footprint: Minimized PCB area usage for high-density board layouts.
• Enhanced Thermal Management: Optimized material conductivity to mitigate heat issues during operation.
• High Durability: Rated for up to 5,000 insertion/ejection cycles.
• Reliable Conductivity: Gold-over-nickel plated terminals for consistent signal integrity.

Package Includes:

• 1 x MUP-C7091-04 8-Pin Push-Push Micro SIM Card Connector.